The SI-G200 high-speed mounter is a two-head model inheriting the advantages of the cellular mounter, including high mounting precision, space saving design, and low power consumption. The high-performance mounter responds to various operational needs by allowing a flexible combination of its replaceable "high speed head" and "multifunction head" so as to best match the production line.

The new SI-G200 compact high-speed mounter achieves tact times as low as 0.08s, equivalent to a sustained placement rate of 45,000 components per hour (CPH), some 70% higher than previous generation solutions. Sony's unique 12-nozzle "planetary" head, combined with high-speed "flying" parts recognition via CCD, offers placement accuracy as high as ±40µm.

With a small overall footprint and width of just 1.2m, the SI-G200 produces maximum return-on-investment (ROI) within valuable production space, achieving component placement rates per square metre of up to 20,000 CPH/m². Its compact design is complemented by extremely high energy efficiency, which cuts running expenses and enables Sony to offer market-leading levels of energy costs when placing large numbers of components.

Multiple SI-G200s can be connected in-line to meet production and throughput demands: a typical 160,000 CPH line can be constructed from four G-Series mounters, reducing linear space requirements by 50% and capital expenditure by around 15%. Cassette loading is from both front and rear, and transport direction can be right-to-left or left-to-right/front, further increasing flexibility.

Top Class productivity per footprint
The two-head model used one head for placement and the other head for pickup. It achieves a dramatically shorter pickup and placement rotation time by making the two mount heads operate simultaneously between the cassette and the PWB. The SI-G200 boasts top-class productivity, placing up to 45,000 components per hour, a 70% improvement over the previous generation.

Higher Placement Speed leads to greater operation capacity
The Planet Head boasts a placement tact time of 0.08 seconds, a speed that outstrips that of large-size machines. The head, consisting of one head and 12 nozzles, can rotate in both direactions upon pickup or placement.

Unparalleled Accuracy
High Speed Head: ±0.045 (3ó) mm Multi Function Head: ± 0.040 (3ó) mm

Highly accurate and highly reliable component recognition
The head recognizes components based on the Flying Vision method using a CCD camera. Due to the imaging approach, it can identify irregular shapes that are difficult to identify using a laser transmission sensor. It can also identify the thickness with high precision, so it does not miss any small chip components being picked up in a standing position.

Appropriate correction and high pickup rate achieved through automated pickup position correction
The head automatically corrects the component pickup position and improves the pickup rate. It accumulates images of the state of component pickup for each cassette during operation. Based on this, it constantly calculates and corrects the differences in the pickup position at the center of the nozzle and the center of the component.

Support Wide variety of components
The heads are very versatile and can support small chip component including 0402 and 0603 chips to bigger components 100 x 50 mm and odd shapes.