The MP300 Autoplacer is a fully automatic pick and place system at entry level price. It is ideal for a high mix, medium volume environment. The MP300 has a flexible and user friendly die sorting S/W, which can easily cope with variable die sizes on multi project wafers. The die can be sorted in up to 256 different bin codes.


System Features          

• Low cost automatic die sort from wafer to tray or film frame
• Can read many wafer map formats
• Supports Multi-Project, Pizza Map, Reticle Mask wafers
• Picks 50µm thick GaAs with air bridges and vias
• Flexible die binning with tray pocket level traceability
• Wafer input up to 300mm, film frames or rings
• Die output to quick change tray fixtures, or film frames

System Specifications
Die size Range	250µm sq. up to 16mm sq., limited by current optics
Die Input Options	Film Frames or wafer rings, in all current designs up to 300mm, expanded or non-expanded
Output Size Range	Output placement envelope 310 mm. sq
Die Output Options	Die trays, pocket or Gel-Pak® style, from 2in sq. up to 300 mm film frames
Placement Repeatability	±50µm
Pickup Tools	Rubber surface pickups, Vespel conductive pickups, Tungsten Carbide collets, Vespel channel pickups Non Surface Contact die pickup process
Pickup Contact	Force 8 to 10 grams
Die Sort Modes	Ink dot recognition, Wafer map driven
Wafer Map Compatibility	SEMI E142, Electroglas 40x0, August Simplified INF, KLA RF, Min WMI, MEC
Throughput	Application dependant. Most applications >2000 UPH
Machine Dimensions	1650mm Wide x 1055mm Deep x 1275 mm High
Machine Weight	Approx 275 kg (600lbs)
Air Supplies	275 kPa to 550 kPa (40-80psi)
Vacuum Supplies	-65 kPa (20in Hg)
Electrical Supplies	110 VAC (240VAC special Order) 8A 50/60 Hz, Single Phase