The DE35-ST is a simple low-cost semi-automatic die handler. The system can handle a very wide range of die size and also has a Non-Surface-Contact option for very fragile or thin die. It has many inspection options to ensure that only good quality die are selected.

System Features

• Available for 150 and 200mm wafers
• Picks die as small as 150 µm square
• Waffle Pak, Gel-Pak® and film frame output
• Underside, facet device inspection options
• Die inverter option
• Throughput of 700-1200 UPH, depending on product
• Quick change over, under 10 minutes
• Optional Non-surface contact operation

             
The System

The DE35-ST semi-automatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Pak®, film frame or directly onto substrates.

The DE35-ST eliminates the inefficiencies and down time usually found in small lot production. Simple to learn and use, the DE35-ST requires no hand tools for die size changeover and setup.

Setup and option information is preserved in non-volatile memory so that, following a weekend shutdown for example, you can restart the machine without further setup.

Waffle pack pockets for die placement are automatically selected. Manual selection using the keyboard arrow keys enables completion of partially filled waffle packs. If a grading output mode is selected, the machine places the die in the next pocket of the corresponding waffle pack and advises the operator when output trays are full.

Non-Surface Contact (NSC) Option

NSC safely picks die with fragile surface geometry or coatings, for example GaAs die with air-bridges or MEMS devices. Die sizes range from 150µm square to over 25mm sq.

Die Underside Inspection Option

Contamination from tape adhesive or backside mechanical defects can be readily identified before placing the die in the output carrier.

Facet Inspection Option

Die edge defects can be inspected using the facet inspection option. Several choices of magnification and illumination are available to suit customer requirements. Please contact our applications team for more details.

High Precision Die Eject Option

The high resolution die ejector is key to handling ultra-thin die without damage. Speed, acceleration and needle stroke are all saved with process recipes for rapid recall.

Optional Die Inverter

After a die is picked from the wafer, it can then be inverted and placed into the output carrier.