Datacon was founded in 1986 and since the beginning of 2005 has been part of the Dutch Besi group (BE Semiconductor Industries N.V.), an international group of companies operating in the semiconductor industry. Datacon's main area of expertise is the development and production of high-precision assembly equipment for the microchip industry. Leading microelectronics companies worldwide such as Bosch, Fairchild, Siemens, Philips, Infineon, ST Micro, Skyworks as well as Asian subcontractors like Amkor, ASE and STATSChipPAC are among Datacon's customers.

Using a highly adaptable platform concept with modular systems, Datacon's product range offers a large degree of flexibility and modularity for the IC manufacturing industry. Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as FLIP CHIP and RFID (non-contact data transmission). Offering dynamic, flexible concept strategies and latest technologies, Datacon is known in the die bonder market as a solution supplier and an essential research partner for the semiconductor industry worldwide.

Multi-Chip Die Bonders
 

Datacon 2200 evo

The bonder generation 2200 evo is the newest bonder and was developed on the basis of the proven 2200 platform and represents a milestone in the field of advanced packaging. Thanks to a dispenser system and bonding system which work in parallel in a single module with up to 6,000 CPH, the 2200 evo from Datacon offers the highest throughput on a footprint of just 116 x 122 cm. The dispenser is not mandatory but can easily be retrofitted if required later, as can a second dispense unit. The highly flexible machine can process up to 25 different 300mm wafers in single pass. 14 different pick-up tools and 5 different ejection tools are additionally available in one module.

Datacon 8800 FC Quantum & Datacon 8800 CHAMEO

The flip chip market will experience extraordinary growth rates in the next several years - and Datacon is prepared for the take-off into high volume. With a large flip chip installed base, Datacon - a pioneer of flip chip from the very beginning - proudly presents to you the powerful 8800 FC high-speed, high-accuracy platform for a wide range of flip chip processes. The 8800 FC platform is not just an upgrade - it's a complete new machine generation for high volume flip chip production. Based on Datacon's expertise gained from many years of experience, the 8800 FC platform will revolutionize the flip chip market.

8800 FC Smart Line

Imagine a flip chip bonder with the highest throughput, extreme precision and 100% final inspection and test, all within the smallest footprint. This is the 8800 FC Smart Line. It seamlessly integrates three machine modules: the 8800 FC Smart Line Flip Chip Bonder with integrated dispenser, the curing station with integrated electrical test, and the optical inspection and reject-marking unit.





High Speed Die Sorters

Datacon DS9000




The Datacon DS9000 system is an optimized platform for sorting 300mm or smaller wafers to tape frame. Automatically sort up to 25 bins with vision inspection and die track mapping.








Datacon DS11000






LED sorter with integrated vision inspection.









Datacon DS9-100





Wafer to wafer Die Sorting for class 100 clean rooms.









Datacon CS1250




High Speed Die Sorter for WLP and other Flipped Devices into Tape and Reel