8800 CHAMEO – speed and reliability

Thanks to the dual-head architecture coupled with optimized processes and assembly strategies, Datacon has developed – based on the high precision of the 8800 Flip-Chip Bonder platform – a multi-flip-chip bonder which is characterized by high throughput with high process reliability and at the same time allows the complete production of a multi-chip product (MCM) in one production cycle. At the same time, it offers all features of a modern machine for high-volume production, such as fully automatic calibration, short conversion times, reject detection, and a data link for factory automation.

Highlights

• Impressive multi-chip capability
• Highest throughput
• Consistent, high precision
• Proven wafer handling
• Powerful image-recognition system
• Unique versatility

Core specifications

• Various flip-chip processes with and without flux dipping
• Assembles strips, boats, PCBs, and wafer substrates
• Throughput up to 10,000 CPH
• 10μm @ 3s precision
• Post-bond inspection
• SECS/GEM data link