Redefining Stacked Die Bonding
The newly developed Esec Die Bonder 2100 sD offers a wide range of benefits with the sole target of producing highest quality at lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in the revolutionary machine concept. Redefining Stacked Die Bonding. For your benefit.

15 μm Accuracy @ 3 Sigma (film based applications)

• Revolutionary Phi-Y pick and place
• Stable high accuracy thanks to vibration control

Widest Application Range

• From epoxy to most advanced stacked die applications
  (amongst others BGA, CSP-BGA, SiP-BGA, FBGA)
• Patented ultra thin die pick up solutions
• 50 N bond force standard
• Up to 125 mm substrate width

Shortest Time to Yield

• Recipe transfer from machine to machine
• Operator independent results due to auto calibration concept
• Tool-less exchange of expansion unit in less than 30 seconds

Highest Up Time

• 4 live camera pictures on display at all time
• Strip and magazine viewers
• Online help
• Easy maintainability

Platform of the Future

• Third process station for additional process expansions
• Expandable for the future thanks to revolutionary machine concept