The Die Bonder 2008 hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008 xP platform.

The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008 hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handles high-end applications on BGA substrates and " to 12" wafers.
The intelligent set-up procedure guarantees repeatable constant bonding quality while the ergonomic human-machine interface (HMI) with its user-friendly graphical user interface GUI makes operating this equipment a real pleasure.