The Die Bonder 2008 SC3plus is the high-speed platform for high volume smart card production ready for 300 mm wafers.

The ultra fast vision system and the enhanced pick & place with its innovative Constant Force Bond Head offer an incredible increase in performance, product quality and yield. With its ergonomically designed human machine interface the Die Bonder 2008 SC3 plus is the most operator-friendly machine available.
The Die Bonder 2008 SC3 plus can handle different types of endless Smart Card tapes. It handles 6" to 12" (300 mm) wafers and guarantees repeatable constant bonding quality, independent of the user. Operators love to run this Esec machine because of the easy access to every module.