The key characteristic of the power semiconductor packaging market is its need for continuous technological progress.

Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.

The Soft Solder Die Bonder 2007SSI plus offers the state-of-the-art technology required for high-quality power devices because it not only characterizes Esec's tremendous degree of expertise and know-how in this field, but also reflects the company's world-leading position in the market for softsolder die attach equipment.