The power semiconductor market requires high throughput and high yields, especially in the cost–sensitive, high-volume DPAK, TO-220, D2PAK and SOT package market.

The fast Soft Solder Die Bonder 2007fSplus has been designed to maximize the product throughput and to cut the equipment delivery time.

Thanks to our in-depth soft solder application know–how, you will also benefit from shorter installation and qualification periods because your applications will virtually run the minute the equipment is out of the box. The 2007fSplus Soft Solder Die Bonder is a robust, high-speed, high-quality soft solder machine that is very competitively priced.