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Datacon CS1250 High Speed Die Sorter for WLP and other Flipped Devices into Tape and Reel

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  • Throughput: 16,000 UPH 
  • Footprint: 1.95m2 (1.65m W x 1.16m D)
  • Placement Accuracy: 25µm@3s
  • Wafer Size: 300mm standard, 200mm capable
  • Die Size: 0.5mm X 0.5mm to 12.5mm X 12.5mm
  • Tape Width: 8mm to 24mm
  • Automatic tape load and tape width adjustment
  • Automatic calibration and drift correction
  • Single touch screen Graphical User Interface
  • 2D Vision inspection for bump damage, edge chips, lasermarks, surface defects and tape seal