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Datacon DS9000 Cassette to Cassette Die Sorting System

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  • Transfer 300 to 200mm wafer frames 
  • Sorting from Wafer to Wafer, Waffle-Pack/Gel-Pack and Tape&Reel
  • LED wafers output to 32 bins
  • Wafer to Die Trays
  • Vision inspection of devices
  • Pick and Place at up to 9000 uph
  • Die as small as 200µm square
  • Large µ Processor die over 25mm square
  • Electronic wafer map input
  • 25 level wafer cassette input
  • 25 level frame cassette output
  • Edge Chip and 2D Bump inspection
  • Standard 255 bin categories
  • Windows® XP
  • Network Ready LED Wafer Processing
  • Pick up to 32 bins and transfer to film frames
  • Adaptive wafer alignment and die pitch correlation software
  • Vision inspect for doublets and die chips / cracks