The SI-V200 has been designed with flexibility in mind to meet the needs of quick change-over manufacturing flows, whilst adding faster image processing speeds with increased accuracy. The VI-200 can inspect both M and L size PCB boards at any stage from pre and post reflow, as well as on solder paste before component placement. The SI-V200's 2MPixel CCD camera delivers 30fps image capture that is combined with a white 3-stage lighting ring to achieve high image stability to deliver a choice of true colour, black-and-white, or a combined inspection options.
 
Sony's telecentric lens enhances accuracy during inspection of adjacent components without distortion across all areas of view, making the SI-V200 ideal for both traditional and newer 3D mounting inspection systems. Precision inspection is maintained through the use of a Sony proprietary Magnascale linear motor mechanism. A 15.5 microns standard optical resolution allows for the inspection of 06063 components and enables a large 24.8 x 18.6mm FOV (field of view) to be scanned. In high-resolution mode the unit runs at 11 microns, scanning an area of 17.6 x 13.2mm enabling scanning of the latest 0402 components.

The SI-V200 is suitable for a variety of inspection points such as shifted/misplaced components, reversed components, incorrect polarity, missing solder, bridging, and solder quantity. The unit accepts a flexible combination of libraries to handle various types of inspection parts including cylinder type chips, tantalum capacitors and transistors. A centralised confirmation and control system enables a single operator to control as many SI-V200-based manufacturing/inspection lines as required.

For use after printing, and before and after reflow
The SI-V200 deals flexibility with respective inspection processes to curtail investments incurred during line changeover. As various settings can be performed quickly and easily via the touch panel, PWB can be inspected without stopping the line.

Increased inspection speed with large FOV
2 mega-pixel colour CCD camera is equipped for capturing images. While maintaining high definition with 15.5 microns resolution, the field of view (FOV) has been enlarged to 24.8 x 18.6 mm to enhance both accuracy and the speed of inspection. In high-resolution mode the unit runs at 11 micron, scanning an area of 17.6 x 13.2mm enabling scanning of the latest 0402 components

Higher image processing speed
The High frame rate of 30 FPS and reinforced image processing system have increased the image capture speed.

One machine to handle M and L size boards
Equipped with a Linear motor to drive the X-axis, the SI-V200 is not only the most compact unit in this class, but also capable of inspecting L-size boards.

Flexible combination of libraries handles various types of chip component
Besides the selection of the applicable standard, the addition of inspection items and addition/movement of the inspection windows, users can conduct the addition or modification of the inspection process. Moreover, as the system is fully open to users, the SI-V200 has excellent expandability, such as in terms of inspection of special components, inspection by a new standard.