The Micron 5003 plus bonder consists of a mineral cast and a X-Y gantry system with ceramic beams, thus affording a very sturdy foundation that is not impacted by temperature. Frictionless airbearings, linear motors and glass scales are also key components of this low-maintenance, highly accurate platform. The Micron 5003 plus comes equipped with a dual-head configuration with programmable bond force that simultaneously handles parallel pick and vision registration, thereby affording a significant increase in UPH in comparison to a single-head system. A wide range of fully automatic die feeding systems, picking tools and substrate materials can be used in parallel or individually.
The Micron 5003 plus Die Bonder provides the best combination of accuracy and speed:
UPH of up to 2,500
Best speed/versatility ratio
Ease of setup thanks to new and improved software: pattern matching on chip and substrate
Ready for no-flow underfill (50 N bond force, optional heating)
Flip Chip Bonders 
The Micron 5003 plus bonder consists of a mineral cast and a X-Y gantry system with ceramic beams, thus affording a very sturdy foundation that is not impacted by temperature. Frictionless airbearings, linear motors and glass scales are also key components of this low-maintenance, highly accurate platform. The Micron 5003 plus comes equipped with a dual-head configuration with programmable bond force that simultaneously handles parallel pick and vision registration, thereby affording a significant increase in UPH in comparison to a single-head system. A wide range of fully automatic die feeding systems, picking tools and substrate materials can be used in parallel or individually.