The FLIPJET FJ520 is the latest evolution of Hesse & Knipps flipchip bonder platform. The substantial experience of Hesse & Knipps in transducer development and ultrasonic technology, combined with a background in building complex machines for fully automatic production has made this development possible. The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. 12").

Process advantages of ultrasonic flipchip technology

• Possible without underfill for some material combinations
• Monometallic connection with lowest possible electrical values for contact resistance, inductivity and capacity
• Finepitch possible down to 20 µm because bumps can not flow into each other

 Precision

• Repeatability of the bonder axes ± 3 μm
• Recognition of "touchdown" without signal delay
• A total of 16 axes are controlled in synchronized motion

 Productivity

• Cycle time approx. 1,0 - 1,2 s (without process time)

 Quality

• Precisely controlled force- and ultrasonic output in up to 8 intervals
• Maintenance free bondhead with solid joints

 Flexibility and process advantages

• Small footprint, big performance
• Integrates easily into complex production lines

 Pattern recognition

• Application-oriented Hesse & Knipps image processing module
• 3 cameras (wafer-, handover- and bondhead camera)
• 2 programmable light sources per camera
• Alternative  pattern recognition

 Quality monitor

• Display of progression of bump deformation over time
• Display of progression of transducer current over time

 User friendly software

• Graphical display of chip position over the substrate
• Visualization of taught reference systems
• Easy definition of multi-up program structures
• User access control in multiple hierarchy levels