Epoxy Die Bonders

Die Bonder 2100 sD

The newly developed Esec Die Bonder 2100 sD offers a wide range of benefits with the sole target of producing highest quality at lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in the revolutionary machine concept. Redefining Stacked Die Bonding. For your benefit.

Die Bonder 2100 xP 

The new epoxy Die Bonder 2100 xP is the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.


Die Bonder 2008 hSplus 

The Die Bonder 2008 hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008 xP platform.

Die Bonder 2008 SC3plus 

The Die Bonder 2008 SC3plus is the high-speed platform for high volume smart card production ready for 300 mm wafers.


Soft Solder Die Bonders

Die Bonder 2009 SSI

The new Die Bonder 2009 SSI is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks to the patented soft solder process technologies the Die Bonder 2009 SSI ensures your leading market position.


Die Bonder 2007SSI Plus

The key characteristic of the power semiconductor packaging market is its need for continuous technological progress.

Die Bonder 2007fS Plus 

The power semiconductor market requires high throughput and high yields, especially in the cost–sensitive, high-volume DPAK, TO-220, D2PAK and SOT package market.