Hesse & Knipps wire bonding and flip chip bonding technology.

Hesse & Knipps are a world leader in the field of ultrasonic welding technology for the microelectronics and semiconductor industries. Hesse & Knipps has been working in the field of industrial automation since 1986 and in 1995 began the start of a successful business building and selling high tech equipment for the semiconductor industry. Their headquarters along with their manufacturing facilities are located in Paderborn, Germany. In addition to their wire and flip chip bonders, Hesse & Knipps develops and manufacture standard and custom automation solutions.

BJ920 Heavy Wire Bonder	BJ820 Fine Wire Bonder	FJ520 Ultrasonic Flip-chip Bonder

Process integrated Quality Control (PiQC)
A unique and revolutionary 100% real time quality test of every bond


E-Box
A patent-registered optical and electrical system for reproducible adjustments of bondhead elements 


PBS200
Process Data Control System allowing a single employee to supervise up to 12 bonders simultaneously. The system provides archiving of production data in one database as well as real-time observation via Online-Display


Automation
A full range of handling and automation solutions are available to meet individual customer requirements. From manual work holders and heated stages through to magazine lifters and fully conveyorised solutions, Hesse & Knipps can provide a handling solution to meet your needs.