Since 1996, TPT has designed and manufactured a range of manual and semi-automatic wire bonding machines and is based in the high technology area of Munich, Germany.
TPT introduced the worlds first wire bonder capable of either Wedge or Ball bonding, simply by the change of its bond tool.
TPT is a privately owned company, with the goal of providing the highest quality wire bonding equipment for the semiconductor and microelectronic industries.
TPT Bonders are in use all over the world from Universities and Colleges to leading Semiconductor, Aerospace and Medical Device manufactures.
 

	TPT HB02 04 05 Manual Wire Bonder   The HB05 is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. One bondhead for bonding Ball/Wedge and for Wedge/Wedge bonding mode. Direct and simple access to all bond parameters and programs. HB02 Wedge Bonder HB04 Ball Bonder HB05 Ball & Wedge Bonder
	Semi automatic wire bonder with motorised Z Axis The HB10 is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. One bondhead for bonding Ball/Wedge and for Wedge/Wedge bonding mode. Direct and simple access to all bond parameters and programs. HB06 Wedge Bonder HB08 Ball Bonder HB10 Ball & Wedge Bonder
	Semi automatic wire bonder with motorised Z & Y axis The HB16 is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. One bondhead for bonding Ball/Wedge and for Wedge/Wedge bonding mode. Easy operation with TFT touch Panel Operator system. Direct and simple access to all bond parameters and programs. HB12 Wedge Bonder HB14 Ball Bonder HB16 Ball & Wedge Bonder
	Semi automatic wire and die bonder The HB16 is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. One bondhead for bonding Ball/Wedge, for Wedge/Wedge and for die bonding mode. Easy operation with TFT touch Panel Operator system. Direct and simple access to all bond parameters and programs. HB16 Ball & Wedge Bonder with pick & place option