The Fico AMS-W is the most economic and flexible MAP molding system, dedicated to the latest trend in single sided packaging. It is the molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi chip array and stacked die.

Standard features
The AMS-W is a very complete machine. Standard features are:

• topedge gating
• transfer pressure control
• cavity vacuum control
• adaptive clamping
• unwanted object detection in the press to prevent damage
• remaining cull detection when molded products are unloaded
• leadframe orientation check with automatic correction
• remote pellet feed with pellet length check
• product lot tracking
• large cull bin, can be emptied while the machine continues production
• user friendly touch screen with all machine manuals
• clean room class 1000 compatible
• CE compliant

Cost of ownership savings

The cost price of a product is a build up of a number of variables. Besides the cost of the materials used, also the machine cost are calculated in the cost of ownership for a product. The newly introduced AMS-W molding system has an extremely low cost of ownership, compared to what is common in the market.

Epoxy determines the biggest part of the price when calculating the cost of ownership of a product. Therefore this is the place where a significant cost reduction can be achieved. Due to the topedge gating technolgy in the AMS-W molding system, a compound reduction of up to 25% is obtained. Injection channels are smaller and no longer cull strength is necessary for the degating process. A lower cull means less waste.
But not only the use of epoxy is reduced. Also the depreciation and labor costs for the AMS-W are reduced up to 33%. Together with these factors, the AMS-W molding system offers the best value for money.


Gold layer

A unique feature of the AMS-W is the topedge construction which makes the use of a gold layer redundant. The topedge strip covers the side of the board and guides the compound through the topedge strip over the board to the gate of the package. No siderail flash is left!


High output

The AMS-W is capable of handling leadframes or boards with dimensions of up to 75 x 280mm. An increase of 46% compared to the averagely used leadframe dimensions. Together with a 50% improved cycle time the UPH of the AMS‑W has more than doubled compared to what is currently common in the molding market. The AMS‑W can process up to 400 leadframes per hour.


Anti warpage

After the molding process, the boards are pushed on the anti-warpage table and are then immediately clamped and cooled down. The boards are cooled down in a controlled way so that they remain perfectly flat, in the correct shape.


Designed for flexibility

For the design of the AMS-W Fico took a different approach. The machine not only had to look good, it also had to be ergonomically accessable. Based upon 50 years of experience in the semiconductor industry, combined with many customer reviews, a complete new design was created. All operator intervention is designed at the front of the machine, at comfortable heights. Together with an intuitive Man Machine Interface (MMI) the AMS-W is a revolution by design!

A product change over on the AMS-W can be carried out very easily. The mold parts can be exchanged within 5 minutes. If you change to a different package height, only the top plate needs to be exchanged. The universal design of the AMS-W results in few product related parts making the machine very flexible.