Product lines

2200 evo
The bonder generation 2200 evo is the newest bonder and was developed on the basis of the proven 2200 platform and represents a milestone in the field of advanced packaging. Thanks to a dispenser system and bonding system which work in parallel in a single module with up to 6,000 CPH, the 2200 evo from Datacon offers the highest throughput on a footprint of just 116 x 122 cm. The dispenser is not mandatory but can easily be retrofitted if required later, as can a second dispense unit. The highly flexible machine can process up to 25 different 300mm wafers in single pass. 14 different pick-up tools and 5 different ejection tools are additionally available in one module.

2200 APM
The 2200 apm Multi Chip Die Bonder is the current industry standard. Based on Datacon's earlier PPS 2200 Multi Chip Die Bonder platform, the 2200 apm is a revolutionary modular system introduced in 1995. It manages to combine extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is fast and simple. The 2200 apm was developed specifically for the demanding advanced packaging market.

2200 APM+
Datacon's newest Multi-Chip Die Bonder, the 2200 apm+, meets the most advanced market challenges. The 2200 apm's industry proven platform concept and superior flexibility are now available on the 2200 apm+, with the added capability of handling wafers up to 300 mm and die up to 50 mm.

FC 8800 Quantum
The flip chip market will experience extraordinary growth rates in the next several years - and Datacon is prepared for the take-off into high volume. With a large flip chip installed base, Datacon - a pioneer of flip chip from the very beginning - proudly presents to you the powerful 8800 FC high-speed, high-accuracy platform for a wide range of flip chip processes. The 8800 FC platform is not just an upgrade - it's a complete new machine generation for high volume flip chip production. Based on Datacon's expertise gained from many years of experience, the 8800 FC platform will revolutionize the flip chip market.

8800 FC Smart Line
Imagine a flip chip bonder with the highest throughput, extreme precision and 100% final inspection and test, all within the smallest footprint. This is the 8800 FC Smart Line. It seamlessly integrates three machine modules: the 8800 FC Smart Line Flip Chip Bonder with integrated dispenser, the curing station with integrated electrical test, and the optical inspection and reject-marking unit.