
16-01-08
Royce Instruments
Royce Instruments range
of bond testing and
die handling equipment
now available from
Accelonix
more >>
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25-03-07
WaveControl
Accelonix are the exclusive
UK distributers for
WaveControl TEM Cell
and RF Field Monitoring
System
more >>
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02-02-07
March
Accelonix are now
the UK source for
March Plasma Systems,
the global leader in gas
plasma technology
more >>
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01-02-07
Sempac
Sempac's range of
Open Cavity Plastic
Packages is now
available from
Accelonix
more >>
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10-01-07
From the UGS News Room
UGS recognized as PLM
software leader in
aerospace, defence,
automotive & high tech
industries
more >>
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01-11-06
Deweyl
Accelonix now
supply DeWeyl's
quality bonding
wedges
more >>
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04-10-06
Prana
Prana's range of
Broadband RF Power
Amplifiers are now
available from
Accelonix
more >>
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07-07-06
Bondjet BJ820
New fully automatic wedge bonder
more >>
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Hesse & Knipps specialise in fully automated microelectronics assembly and packaging equipment. The range of equipment available includes fine wire bonders, heavy wire bonders, ultrasonic flip chip bonders and dispensers as well as engineered systems up to complete production lines.
All of these machines have an inline capability and can be equipped with a wide range of handling and lift systems. A PC based process data control system can track production on up to 50 machines and systems. It can archive and analyse data and communicate with other systems such as SAP.
Hesse & Knipps products available from Accelonix:
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Bondjet BJ820
Fully Automatic Ultrasonic Thin Wire Bonders. These machines offer the ultimate in automatic wedge-wedge bonding.
Handling gold and aluminium ribbon and wire with diameters from under 12.5 µm to 60 µm (optional up to 85µ), they feature the largest working area available in the market (up to 305mm x 410mm),
fine pitch capability to under 40 µm,small footprint,high speed, high throughput and the revolutionary maintenance-free piezo bondheads.
The availability of three interchangeable bondheads: 45°, 60° and 90° adds to the system's acknowledged flexibility.
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BondJet BJ-7xx and BJ-8xx
Fully Automatic Ultrasonic Thin Wire Bonders. These machines offer the ultimate in automatic wedge-wedge bonding.
Handling gold and aluminium ribbon and wire with diameters from under 17.5 µm to 85 µm, the working area available is up to 305mm x 185mm,
fine pitch capability to under 45 µm, high throughput and the revolutionary maintenance-free piezo bondheads.
The availability of three interchangeable bondheads: 45°, 60° and 90° adds to the system's acknowledged flexibility.
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BondJet BJ-9xx
Fully Automatic Heavy Wire Bonders. This, the new generation of Heavy Wire bonders features a massive working area up to 500mm x 380mm.
It can handle wire diameters from 100 µm to 500 µm and has a host of features to give a great combination of flexibility and productivity
including integrated shear testing, E-box tool setup feature, choice of front or back cut bondheads and vibration control.
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FlipJet FJ-51x
Fully Automatic Ultrasonic Flip-Chip Bonders.
In comparison to other flip chip processes the ultrasonic flip-chip bonding allows a four to five-fold improvement in contact density.
A further advantage is that a single process step is required for the entire chip attach. The process yields extremely high mechanical strength and stability
and delivers connections with excellent thermal properties. It is aalso a very clean process, requiring no adhesives, monometallic connections and is entirely lead-free.
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DJ-3xx
Fully Automatic Dispensers.
The DJ-3xx range of automatic dispensing equipment is characterised by high accuracy - 15µm and 1nl - and large working area - 457mm x 356mm.
The DJ-3xx is highly flexible: up to five different valves or tools may be fitted; there are three different height measurement options and a wide range of automation and indexing possibilities.
It can use various types of valve including rotary auger valves, time / pressure valves, spray pressure valves and piston or needle proportional valves.
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Automation Solutions
Hesse & Knipps specialise in automation solutions. A range of standardized indexers and handling systems is available, including width-adjustable
indexers up to four lanes, loading and unloading lifts and various heating tables and pre-heating stages. These can be customised and engineered
to meet your precise requirements.
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Accelonix Limited
Solutions Provider for EMC/EMI/RF, PCB Assembly and Test, Microelectronics Assembly and Programming strategies
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| Address |
| 10 Anstey Road |
| Alton |
| Hampshire |
| GU34 2RB |
| U.K. |
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| General: |
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+ 44 (0) 1420 590000 |
| Fax: |
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+ 44 (0) 1420 82123 |
| Data I/O Support: |
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+ 44 (0) 772 517 3456 |
| UGS Tecnomatix Support: |
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+ 44 (0) 1702 304 810 |
| Microelectronics Assembly Support: |
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+ 44 (0) 7921 089 266 |
| Email: |
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| E&OE ©2002-2005 Accelonix Limited :: Terms and Conditions of Use |
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