16-01-08
Royce Instruments
Royce Instruments range
of bond testing and
die handling equipment
now available from
Accelonix
more >>
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25-03-07
WaveControl
Accelonix are the exclusive
UK distributers for
WaveControl TEM Cell
and RF Field Monitoring
System
more >>
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02-02-07
March
Accelonix are now
the UK source for
March Plasma Systems,
the global leader in gas
plasma technology
more >>
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01-02-07
Sempac
Sempac's range of
Open Cavity Plastic
Packages is now
available from
Accelonix
more >>
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10-01-07
From the UGS News Room
UGS recognized as PLM
software leader in
aerospace, defence,
automotive & high tech
industries
more >>
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01-11-06
Deweyl
Accelonix now
supply DeWeyl's
quality bonding
wedges
more >>
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04-10-06
Prana
Prana's range of
Broadband RF Power
Amplifiers are now
available from
Accelonix
more >>
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07-07-06
Bondjet BJ820
New fully automatic wedge bonder
more >>
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Laurier is a manufacturer of back-end microelectronic assembly equipment and produces industry leading products in three key areas: Die Sorting, Flip Chip Bonding and Tray Handling.
Laurier integrates leading edge technologies and processes into innovative assembly solutions for the semiconductor and related industries.
High Precision Flip Chip Bonding
High accuracy bonding applications demand equipment with sub micron resolution.
Laurier flip chip bonders are commonly used in the assembly of focal plane arrays / detectors, optical components, MCM
and advanced processes that include wafer to wafer and die to wafer bonding.
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M9
The M9 is a +/- 0.5 Micron Flip Chip Die Bonder. Applications include manual and semi-automatic flip chip applications for low volume high mix environments.
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CDB50
The CDB50 is a semi-automatic to automatic flip chip die bonder. It achieves +/- 1 micron accuracy in prototype and production applications.
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Die Sorters
Laurier is the leader in Die Sorting – offering the Semiconductor and Electronics industries advanced technologies to the KGD, WCSP and LED products sectors, sorting die into tape reel, tape frame, chip tray, and other carriers.
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DS-9000CC
The DS-9000CC sorts 300mm wafers into 200mm frames, waffle packs or Gelpacks at up to 9000 devices per hour.
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Maverick
The Maverick is the fastest wafer to tape and reel system on the market, sorting from bumped wafers at up to 12,000 devices per hour.
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DS9-100
The DS9-100 is for wafer to wafer sorting in a class 100 clean room environment.
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DS9000 LED
The DS9000 LED is an LED sorter,with integrated vision inspection, sorting LED die into 32 bins.
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DS4000
The DS4000 is highly flexible, picking and placing a variety of devices including silicon, GaAs, WLCSP, Flip Chips, MEMS, BGA's, laser bars, RF Components, Opto Devices, Diodes and more.
It can pick from from tape, reel and waffle packs, GEL-PAKs or JEDEC Trays and places into waffle packs, GEL-PAKs, film frames and hoops, JEDEC trays, tape and reel or custom carriers.
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Tray Handling
Laurier's OEM array of product offerings includes automated handling of Jedec,
waffle packs, and other common carriers for microelectronic components.
Compact, low cost tray handlers provide efficient, simple to integrate solutions
for SMT, Test and other equipment suppliers
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JTF2
TrayStak® Feeders for loading and unloading stacks of JEDEC trays full of product without interrupting production.
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WPF
TrayStak® Feeders for loading and unloading stacks of 2 & 4 Inch Waffle Packs full of die without interrupting production.
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Home | News | Service | Contact | Jobs
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Accelonix Limited
Solutions Provider for EMC/EMI/RF, PCB Assembly and Test, Microelectronics Assembly and Programming strategies
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| Address |
| 10 Anstey Road |
| Alton |
| Hampshire |
| GU34 2RB |
| U.K. |
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| General: |
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+ 44 (0) 1420 590000 |
| Fax: |
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+ 44 (0) 1420 82123 |
| Data I/O Support: |
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+ 44 (0) 772 517 3456 |
| UGS Tecnomatix Support: |
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+ 44 (0) 1702 304 810 |
| Microelectronics Assembly Support: |
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+ 44 (0) 7921 089 266 |
| Email: |
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| E&OE ©2002-2005 Accelonix Limited :: Terms and Conditions of Use |
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