Friday
25 July 2008

Product lines

Royce Instruments

System 650 Universal Bond Tester
Go Back to Royce Instruments Page

16-01-08
Royce Instruments Royce Instruments range of bond testing and die handling equipment now available from Accelonix more >>
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25-03-07
WaveControl
Accelonix are the exclusive
UK distributers for
WaveControl TEM Cell
and RF Field Monitoring
System
more >>
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02-02-07
March
Accelonix are now
the UK source for
March Plasma Systems,
the global leader in gas
plasma technology
more >>
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01-02-07
Sempac
Sempac's range of
Open Cavity Plastic
Packages is now
available from
Accelonix
more >>
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10-01-07
From the UGS News Room
UGS recognized as PLM
software leader in
aerospace, defence,
automotive & high tech
industries
more >>
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01-11-06
Deweyl
Accelonix now
supply DeWeyl's
quality bonding
wedges
more >>
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04-10-06
Prana
Prana's range of
Broadband RF Power
Amplifiers are now
available from
Accelonix
more >>
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07-07-06
Bondjet BJ820
New fully automatic wedge bonder
more >>
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System Features

Motorized height controlled microscope that stays in focus as it moves
305 mm x 155 mm stage for 300 mm wafers, leadframes or substrates
Ultra Fine Pitch (UFP) capable
Image Capture Option which is Field Upgradeable.
Ribbon Bond testing for standard to high-end power devices
World language support
Small foot print with built-in, standard Windows XP PC
Test module range switching
Die shear up to 200 kgf
Robust test modules with calibration memory and tool protection

Test Modules	Primary Range	Selectable Sub-Ranges
Wire Pull Modules	100 gf 1 kgf 10 kgf	50 gf 500 gf 5 kgf	20 gf 200 gf 2 kgf	10 gf 100 gf 1 kgf
Die Shear Modules	20 kgf 200 kgf	10 kgf 100 kgf	5 kgf 50 kgf	2 kgf 20 kgf
Wire Bond Shear Modules	250 gf 1 kgf 5 kgf	100 gf 500 gf 2 kgf	50 gf 200 gf 1 kgf	25 gf 100 gf 500 gf
CBP / Tweezer Pull Modules	100 gf 1 kgf 10 kgf	50 gf 500 gf 5 kgf	20 gf 200 gf 2 kgf	10 gf 100 gf 1 kgf

System Specifications
Internal Computer	Integrated high performance industry standard PC. Internal DVD-CD RW drive, USB, network ports
Servo driven X/Y Stage	Standard, 305 mm x 155 mm
X,Y Resolution	1 micron
Z Resolution	0.1 micron
Total System Accuracy	0.15%
Step back accuracy	1 micron over 25 micron travel
Loop Height Measurement	Yes
Force Profile	Yes
International Standards	Mil Std 883, Mil Std 750, ASTM F1269, JESD22-B117, JESD22- B116 and CE Certified. Lead free ROHS compliant.

Mainframe Dimensions & Facility Requirements
Dimensions	Height - 560 mm, 25 in Width - 432 mm, 17 in Depth - 585 mm, 23 in
Weight	55 kg, 120 lbs
Power Supply	Automatic International voltage selection 110 to 220 VAC 50 to 60 Hz
Pneumatic Supply	4.0 - 5.5 bar (60-80 psi)
Vacuum Supply	500 mm Hg, 25 in Hg

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Accelonix Limited
Solutions Provider for EMC/EMI/RF, PCB Assembly and Test, Microelectronics Assembly and Programming strategies

Address
10 Anstey Road
Alton
Hampshire
GU34 2RB
U.K.

General:		+ 44 (0) 1420 590000
Fax:		+ 44 (0) 1420 82123
Data I/O Support:		+ 44 (0) 772 517 3456
UGS Tecnomatix Support:		+ 44 (0) 1702 304 810
Microelectronics Assembly Support:		+ 44 (0) 7921 089 266
Email: