16-01-08
Royce Instruments
Royce Instruments range
of bond testing and
die handling equipment
now available from
Accelonix
more >>
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25-03-07
WaveControl
Accelonix are the exclusive
UK distributers for
WaveControl TEM Cell
and RF Field Monitoring
System
more >>
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02-02-07
March
Accelonix are now
the UK source for
March Plasma Systems,
the global leader in gas
plasma technology
more >>
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01-02-07
Sempac
Sempac's range of
Open Cavity Plastic
Packages is now
available from
Accelonix
more >>
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10-01-07
From the UGS News Room
UGS recognized as PLM
software leader in
aerospace, defence,
automotive & high tech
industries
more >>
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01-11-06
Deweyl
Accelonix now
supply DeWeyl's
quality bonding
wedges
more >>
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04-10-06
Prana
Prana's range of
Broadband RF Power
Amplifiers are now
available from
Accelonix
more >>
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07-07-06
Bondjet BJ820
New fully automatic wedge bonder
more >>
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For over 23 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment.
Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak™
Bond Testing Equipment
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System 650 (Click for more information)
Universal Bond Tester.
System Features
- Motorized height controlled microscope that stays in focus as it moves
- 305 mm x 155 mm stage for 300 mm wafers, leadframes or substrates
- Ultra Fine Pitch (UFP) capable
- Image Capture Option which is Field Upgradeable.
- Ribbon Bond testing for standard to high-end power devices
- World language support
- Small foot print with built-in, standard Windows XP PC
- Test module range switching
- Die shear up to 200 kgf
- Robust test modules with calibration memory and tool protection
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System 226 (Click for more information)
Dedicated Wire Pull Tester.
System Features
- Dedicated wire pull system, for up to 100g
- High-end standard of accuracy and repeatability at an entry-level price
- Flexible and inexpensive way to perform precision destructive and non-destructive testing (NDT) of wire bond loops
- Small footprint makes economic use of cleanroom space
- Meets requirements of MIL Standard 883 and is CE Certified
- Download data to in-house SPC using RS232
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Die Handling Equipment
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AutoPlacer MP300 (Click for more information)
Automatic Die Handling & Sorting System.
System Features
- Low cost automatic die sort from wafer to tray or film frame
- Can read many wafer map formats
- Supports Multi-Project, Pizza Map, Reticle Mask wafers
- Picks 50µm thick GaAs with air bridges and vias
- Flexible die binning with tray pocket level traceability
- Wafer input up to 300mm, film frames or rings
- Die output to quick change tray fixtures, or film frames
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System DE35-ST (Click for more information)
Semi-Automatic Die Handling System.
System Features
- Available for 150 and 200mm wafers
- Picks die as small as 150 µm square
- Waffle Pak, Gel-Pak® and film frame output
- Underside, facet device inspection options
- Die inverter option
- Throughput of 700-1200 UPH, depending on product
- Quick change over, under 10 minutes
- Optional Non-surface contact operation
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Accelonix Limited
Solutions Provider for EMC/EMI/RF, PCB Assembly and Test, Microelectronics Assembly and Programming strategies
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| Address |
| 10 Anstey Road |
| Alton |
| Hampshire |
| GU34 2RB |
| U.K. |
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| General: |
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+ 44 (0) 1420 590000 |
| Fax: |
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+ 44 (0) 1420 82123 |
| Data I/O Support: |
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+ 44 (0) 772 517 3456 |
| UGS Tecnomatix Support: |
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+ 44 (0) 1702 304 810 |
| Microelectronics Assembly Support: |
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+ 44 (0) 7921 089 266 |
| Email: |
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| E&OE ©2002-2005 Accelonix Limited :: Terms and Conditions of Use |
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