 16-01-08
Royce Instruments
Royce Instruments range
of bond testing and
die handling equipment
now available from
Accelonix
more >>
--------------------------
25-03-07
WaveControl
Accelonix are the exclusive
UK distributers for
WaveControl TEM Cell
and RF Field Monitoring
System
more >>
--------------------------
02-02-07
March
Accelonix are now
the UK source for
March Plasma Systems,
the global leader in gas
plasma technology
more >>
--------------------------
01-02-07
Sempac
Sempac's range of
Open Cavity Plastic
Packages is now
available from
Accelonix
more >>
--------------------------
10-01-07
From the UGS News Room
UGS recognized as PLM
software leader in
aerospace, defence,
automotive & high tech
industries
more >>
--------------------------
01-11-06
Deweyl
Accelonix now
supply DeWeyl's
quality bonding
wedges
more >>
--------------------------
04-10-06
Prana
Prana's range of
Broadband RF Power
Amplifiers are now
available from
Accelonix
more >>
--------------------------
07-07-06
Bondjet BJ820
New fully automatic wedge bonder
more >>
--------------------------
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System Features
- Low cost automatic die sort from wafer to tray or film frame
- Can read many wafer map formats
- Supports Multi-Project, Pizza Map, Reticle Mask wafers
- Picks 50µm thick GaAs with air bridges and vias
- Flexible die binning with tray pocket level traceability
- Wafer input up to 300mm, film frames or rings
- Die output to quick change tray fixtures, or film frames
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| System Specifications |
|---|
| Die size Range |
250µm sq. up to 16mm sq., limited by current optics |
| Die Input Options |
Film Frames or wafer rings, in all current designs up to 300mm, expanded or non-expanded |
| Output Size Range |
Output placement envelope 310 mm. sq |
| Die Output Options |
Die trays, pocket or Gel-Pak® style, from 2in sq. up to 300 mm film frames |
| Placement Repeatability |
±50µm |
| Pickup Tools |
Rubber surface pickups, Vespel conductive pickups, Tungsten Carbide collets, Vespel channel pickups Non Surface Contact die pickup process |
| Pickup Contact |
Force 8 to 10 grams |
| Die Sort Modes |
Ink dot recognition, Wafer map driven |
| Wafer Map Compatibility |
SEMI E142, Electroglas 40x0, August Simplified INF, KLA RF, Min WMI, MEC |
| Throughput |
Application dependant. Most applications >2000 UPH |
| Machine Dimensions |
1650mm Wide x 1055mm Deep x 1275 mm High |
| Machine Weight |
Approx 275 kg (600lbs) |
| Air Supplies |
275 kPa to 550 kPa (40-80psi) |
| Vacuum Supplies |
-65 kPa (20in Hg) |
| Electrical Supplies |
110 VAC (240VAC special Order) 8A 50/60 Hz, Single Phase |
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