Product lines

A Cost Effective Alternative to Ceramic Packaging

SEMPAC offers many Open Cavity Plastic Packages providing for innovative manufacturing solutions.

• Ideal for Device Development for Telecom, Optoelectronic, RF MEMS and SensorDevices
• Bring new devices for Cell Phones, PDA’s and Digital Cameras to the market quicker
• Packages meet JEDEC Outline and Footprint, are Reliable and Low Cost
• Ideal solution for Device Development and Die Qualification
• Compatible with High Volume Plastic Packages

Open-PakTM, Open Cavity Plastic Packages provide a low cost solution to that of costly ceramic packages. SEMPAC has a wide range of product offerings, QFN, QFP & SOIC/SSOP, including semi-seal and full seal plastic, ceramic or glass lids for each product line. SEMPAC also provides design, development and manufacture of custom packaging for clients whom have special packaging requirements, and provides a vast array of special molding of client material requiring plastic encapsulation of such products as printed substrates.

Product Technology

SEMPAC offers an innovated manufacturing technology solution for small outline integrated circuit packaging. Their products aid in the manufacturing and development of Telecommunication, Optoelectronic, RF, MEMS and Sensor devices. Their packaging technology has been used to bring new devices for Cell phones, PDA’s and Digital cameras to market quicker, by reducing development costs and allowing their customers to get new products into the market faster.

Products

SEMPAC offers a line of Open-PakTM, open cavity plastic integrated circuit packages. Their pre-molded, air cavity packages meet the latest JEDEC outline and footprint standards, allowing their customers to develop devices in the same configuration used in high volume production which helps to streamline testing and reduce costs. Many of their products offer a significant cost saving over ceramic IC packages. Most of their packages are offered in a thermally enhanced version.

Open-PakTM packages are offered in various standard JEDEC outlines, which include QFN, QFP, SOIC and SSOP configurations. They also partner with customers to develop custom packages to meet their customers exacting specifications.

Advantages:

Open-PakTM packages are newly manufactured parts that provide customers with many advantages over reclaimed or reworked alternatives. Their packages are constructed from semiconductor grade plastic materials, copper lead frames and are gold plated to military standards. This rugged construction is mechanically stable and has similar electrical characteristics to fully encapsulated molded packages. Unlike reclaimed packages their products do not require nitrogen controlled storage and can be easily assembled using standard manufacturing practices. Their products can be assembled in an in-house assembly laboratory without sophisticated assembly equipment.

Let Open-PakTM products minimize your packaging costs and reduce the time to market of your new products.

Sempac's products are an ideal solution for applications that require an air cavity, such as digital cameras, sensors and any device that required open access, as well as integrated circuit die qualification, device prototyping, and small lot and engineering assembly build requirements. Open-PakTM products are idea for quick turn assembly for customer samples and to meet your interim or pre-production assembly builds.