Good is not good enough
The Fico Singulation range of singulation machines has a proven reputation for innovation, quality, reliability and high volume output. Each system has been designed to meet the challenges of today's ever more demanding manufacturing processes. The equipment will significantly increase yields, whilst keeping cost of ownership low. On top of this, our process knowledge and process support assists you in improving your current processes and help you with the introduction of new packages.

Process
Fico not only supplies the machinery for singulation, but also assists you with the determination of your process parameters. The Fico Process Technology department can help you out in the development of new products, where product and machine are optimally adjusted to each other.

 Fico ISS

The Fico ISS is the new generation, fully automatic saw singulation system. Based on the former MISS II system, this new system comprises all of the advanced new technologies developed by Fico. The high quality singulation and advanced inspection & sorting methods are suited for a wide variety of products. Overmolded caps, substrate materials or film based array substrates, they are all product types that can be singulated with the Fico Integrated Sawing System. Fico’s long term experience and high quality standard offer a unique and cost effective solution for saw singulation and sorting of your products.

Fico Bright Line

The Fico Bright Line™ is a system for both Laser Singulation of packages as well as depaneling of integrated circuits on boards (modules). The system can be equipped for products on wafer frames, leadframe carriers, substrates and similar.
Applications can be found in extremely small semiconductors such as BCCs, singulation of memory cards like µSD, depanelisation of modules and others