Fico Bright Line
The Fico Bright Line™ is a system for both Laser Singulation of packages as well as depaneling of integrated circuits on boards (modules). The system can be equipped for products on wafer frames, leadframe carriers, substrates and similar.
Applications can be found in extremely small semiconductors such as BCCs, singulation of memory cards like µSD, depanelisation of modules and others.


Advantages of laser

The Fico Bright Line offers a number of technical as well as cost of ownership advantages when compared with other singulation processes:

• special, irregular shapes can be cut 
• optimal utilization of the substrate is possible 
• highly flexible 
• no tool wear 
• dry cutting process  
• no forces on the product 
• perfect depaneling solution

All materials are handled automatically and the singulated products are sorted without leaving any empty pockets.


Laser types

Depending on your application, a different laser type can be chosen. All lasers are especially featured and developed for the Fico laser singulation process. Laser types that are available on the Fico Bright Line are:

• UV laser  
• Green laser 
• YAG laser 
• CO2 laser

Even more laser types are under development in close cooperation with different laser suppliers and universities.


Shape dynamics

The contours described by the laser are freely programmable. The laser can start at any point on the product and is able to describe any curve, radius or complicated corners and angles. Dynamic shape programming allows full utilization of your substrates. The singulation process is no longer the limit of the substrate lay-out.


Modular approach

A complete Fico Bright Line is put together from different modules. Since a wide variety of loaders and offloaders can be supplied on the FBL, the Fico sales department will help you out assembling your customized configuration.
Modules that can be supplied on the FBL are:

• slotted magazine loading  
• stack magazine loading  
• infeed track  
• different laser types, depending on your product  
• ultrasonic product cleaning  
• dry brush cleaning  
• vision check (incl. product quality check)  
• reject and sort functionality  
• all possible offloading types