The SI-F130AI high-speed mounter provides a cost-effective pick-and-place solution that enables rapid return-on-investment. The F Series has been proven in Sony's own production facilities and by third parties over an extended period of time.

Equipped with high-speed on-the-fly parts recognition, the SI-F130AI features an image processing system that automatically generates image data for complex new parts. Its compact "cellular" design extends Sony's approach of offering a market-leading combination of speed, placement accuracy, and small footprint, to help create production lines that are flexible and expandable and thus improve cost-performance figures.

Planetary Head Achieving 25,900 CPH
The Planet Head - the world's most compact rotary head, features rotary indexer-equivalent precision. This precision is realized by controlling the planet gears with a full closed rotary servo. And with bi-directional head rotation supporting optimal head control, the loss in operating cycle time has been greatly reduced.

Placement tact time of 0.139 sec
By achieving a placement tact time of 0.139 seconds and eliminating the cycle loss time when changing PWBs, production performance has been dramatically improved. Functions contained within the compact body of this machine is superior to those other large-size machines.

Flying Vision
The part recognition camera is mounted on the head to monitor and to eliminate any decrease in mounting precision due to temperature fluctuation.

Splicing & Cassette alternation
The provided splicing cassette eliminates the need to stop the equipment when supplying parts. Even if there is no splicing cassette, the alternation function of the cassette group can swap cassettes that have run out of parts during operation in order to achieve non-stop operation.

Automatic generation of recognized objects
A newly developed image processing system is installed to provide an extremely sophisticated shape recognition function that can rapidly generate image data for complex new parts.

Part thickness recognition camera
Part thickness recognition is implemented with a CCD camera so that ultra small chip component, which tend to be picked up in standing position, as detected.