Leadless Packages
Leadless packages form one of the fastest growing package types. They provide many advantages in heat transfer, RF characteristics and PCB densities. Examples of these packages are: MLF, QFN and VQFN. To this family we can also count packages with short unformed (straight) leads. Fico has developed a unique patented approach to punch isolation and singulation of leadless packages. This process is guaranteed crackfree and delamination free. The Fico Compact Line offers a full range of modules to cover all possible manufacturing processes in leadless packages: isolation, strip testing, laser marking, singulation, inspection, sorting and offloading into: tube, tray, bulk or tape & reel.
Configurations are available that cover any selection of the above process steps.

Packages with leads
Packages with leads such as (T)QFP, (T)SSOP, TSOP and SOIC still form the majority of todays manufactured packages. The main driver in this market is the final cost of a device. A dedicated singulation unit in the Fico Compact Line allows matrix singulation (multiple rows and columns) for most packages. An approach that clearly increases output as singulation is often the bottleneck in form/singulation systems. The Fico Compact Line offers a full range of modules to cover all possible manufacturing processes for these packages: isolation, laser marking, form/singulation, inspection, sorting and offloading into: tube, tray, bulk or tape & reel. Configurations are available that cover any selection of the above process steps.

Tools
The Fico Compact Line is equipped with tools that have patented designs for:
Punch-singulation of High Density QFN devices.
Non returning slugs provisions.
Bending parts with FiCoating® which decimates your cleaning cost by reducing the intervals between tool cleaning (Up to 10x less compared to todays cleaning intervals). These coated parts ensure a constant process quality: FiCoating® prevents tin build-up on active tool parts. A new manufacturing process extends the lifetime by reducing wear of product related parts.
No regrinding requirement for punches and inserts (maintenance free).

The compact tool construction makes operator handling easy:
Weight of the tool is approx 10 kg.
Simple wireless plug-in concept.
Multi-up leadframe handling: Tool width 100 mm.
Capable to handle lead frames up to 4 inch width