The leading-edge and maintenance-free TY bond head technology of Esec is improved to a hitherto unreached level. With its stiffened air bearings and the more powerful axis motors, the Esec Wire Bonder 3200 reaches best-in-class UPH figures. And, to top it up, when it comes to ultrafine-pitch applications, the Wire Bonder 3200 is not only the fastest, but also the most accurate wire bonder available!

The new Esec Wire Bonder 3200 is keeping its leading position and is preparing the road to future fine-pitch applications.

Revolutionary TY Technology

• Low inertia mechanical design, high efficiency servo motor system
• Unrivalled in wire bonding performance for speed, accuracy and stability
• Unprecedented placement accuracy over the entire bond range

Maintenance-free Air Bearing Technology

• High stiffness design guarantees reliability and performance
• Frictionless design ensures highest acceleration to achieve optimal UPH

Optimal Process Capabilities

• Gold and copper wire bonding processes
• 3 modes of Non-Stick Detection for real time monitoring on the wire cycle
• Advanced looping capabilities (e.g. Standard & Folded Ultra Low Loops <50 µm)
• Advanced process capabilities (eg. Ball and Wedge scrub mode, QFN mode)
• Recipe Portability

Superior Vision System

• High resolution and magnification for <35 μm process recipe teaching
• Visual Ball Inspection (VBI) feature for in-process quality checks
• Programmable Auto Focus proven in advanced stacked die applications

Interactive Graphical User Interface (GUI)

• Excellent learning aids – on-screen video sequence and graphical animations
• Multilingual capability provides greater independence for worldwide customers