Thanks to its unique rotating bondhead, it surpasses existing performance barriers and delivers unprecedented levels of speed and accuracy.

The secret to this quantum leap in performance lies in Esec's new TY technology. This method uses entirely new kinematics making it possible to achieve higher acceleration with reduced vibration.

What's more, the 3100's multi-lingual graphical user interface and ergonomic design afford an entirely new dimension of user friendliness in semiconductor manufacturing equipment.
 

Revolutionary TY technology

In conventional wire bonder design, the bondhead is mounted on an orthogonal x/y stage. By way of contrast, Assembly Equipment's TY technology links rotational with linear motion to create a theta/y movement. This new principle has several advantages.
The use of rotation enables the mass to be concentrated near the theta axis, thus reducing the mass moment of inertia. Thanks to this reduction, as well as the pivoting principle employed, higher acceleration can be achieved with less motor force.
Another major advantage is the small amount of energy needed to accelerate and brake the bondhead. Less energy means a lower level of vibration and therefore shorter settling times.

Maintenance-free airbearing technology

The bondhead of the Esec WB 3100 is controlled by high-precision, extremely accurate airbearing technology, the components of which are essentially free of wear and tear. And that results in extremely reliable, maintenance-free performance.
This technology has many proven advantages, which is why we chose to make it an integral part of our most innovative Wire Bonder ever. The same technology is also used in the 3100's single clamp indexer and the programmable focus of its optics system.

Optimal process capabilities

In full production mode, the Esec Wire Bonder 3100 can handle high-speed wire bonding fine pitch applications down to 45 µm. Also, it can accommodate the widest range of leadframe and organic substrate applications.
The Esec Wire Bonder 3100 utilizes mechanical and software innovations that have been developed to master the most demanding process challenges. One example is its programmable heater height feature, which ensures orthogonal capillary impact on the bond zero point. And another is its dynamic impact measure, located close to the capillary tip.
The 3100's integrated statistical process control system monitors and analyzes all relevant process parameters, and intervenes in the bonding process if necessary.

Ergonomic Human Machine Interface (HMI)

The HMI of the Esec Wire Bonder 3100 was developed in collaboration with our customers. The result is a study in ergonomics. Fully compliant with the SEMI S8-0701 safety guideline for ergonomics engineering, this interface enables the 3100 operator to work with the greatest of ease. An optimized keypad ensures fast and simple handling, while providing direct access to 90% of all assist functions.

User-friendly Graphical User Interface (GUI)

One of the highlights of the 3100's HMI is its graphical user interface. Designed in accordance with the Sematech GUI Style Guide, it enables operators to work with ease and, thanks to its unique multi-lingual capability, with greater independence. Furthermore, operators in need of assistance can utilize the various pre-packaged help functions and explanatory video sequences.