High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 Thin Wire Bonder is the latest development of Hesse & Knipps' wedge bonding innovation, responding to all wire bonding challenges on a single platform for a variety of applications such as RF and microwave devices, COB, MCM and hybrids, fibre-optics and automotive using aluminium wire, gold wire or ribbon. The BJ820 defines the benchmark in the industry by offering:

• The fastest wedge bonder
• The largest work area
• The greatest axis accuracy

Precision:

• Axis repeatability of 1 μm at 3 σ at an interpolated encoder resolution of 20 nm
• Instantaneous recognition of "touchdown"-signal
• Precise force control with an accuracy of 1 cN (static and dynamic)

Productivity:

• Bond speed up to 7 wires per second
• Parallel bond stations within workarea for throughput optimization

Quality:

• E-Box : patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
• Precise output of force and ultrasonics in up to 4 intervals
• Maintenance free piezo bondhead
• Mechanical stiffness of the bondhead
  • reduced vibrations
  • highest bond speed and best bond quality

 Flexibility and process advantages:

• Small footprint, big performance
• Integrates easily into complex production lines
• Extreme short and long loops 70 μm to over 20 mm
• Fine Pitch capability < 40 μm
• Deep Access or 60° bondheads available as option
• Easy bondhead change in less than 15 minutes
• Free programmable wire feed, tail length, tear stroke and opening gap of wire clamp
• Flexible utilization of extra large workarea by multiple bond stations (manually loaded or automatic indexer)

 Pattern recognition

• Application-oriented Hesse & Knipps image processing module
• Programmable illumination with 2 (standard) light sources
• Alternative  pattern recognition
• Mini-CCD camera with OCIR Norm

Quality monitor

• Monitoring of wire deformation and transducer current and comparison against fixed target curves for detection of outliers and wire loss
• PiQC optional

User friendly software

• Portability of bond programs
• Graphical display of programmed wires
• Visualization of skilled reference systems
• Free programmable loop shapes
• Easy definition of multi-up program structures
• User access control in multiple hierarchy levels
• Program change within seconds
• The software supports the connection to PLC/Host computer via Profibus