The TPT Manual Wirebonder is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. It can be configured for Wedge bonding, Ball bonding or both. One bondhead for bonding Ball/Wedge and for Wedge/Wedge bonding mode. Direct and simple access to all bond parameters and programs.

• for 17µ to 50µ Wire and 25µ x 200µ Ribbon
• 90° Bonding Deep-access
• Bond arm length 165 mm  
• Stitch and bump bonding
• 20 Program storage capacities
• Built in Heater stage Controller
• 2” Wire Spool
• PLL Ultrasonic generator
• 6 : 1 ratio X-Y manipulator
• Electronic ball size control