The Semi-Automatic TPT wirebonder is a bench top size wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. It can be configured for Wedge bonding, Ball bonding, or both. One bondhead for bonding Ball/Wedge and for Wedge/Wedge bonding mode. The bonder has an in-built touch-down sensor, which means that stage adjustments for different bond heights is not necessary. Direct and simple access to all bond parameters and programs.
 

• for 17µ to 50µ Wire and 25µ x 200µ Ribbon
• 90° Bonding Deep-access
• Bond arm length 165 mm
• Motorised Z
• Loop Height programable
• Stitch and bump bonding
• 20 Program storage capacities
• Built in Dual Fiber Optic illuminator
• Built in Heater stage Controller
• Motorised 2” Wire Spool
• PLL Ultrasonic generator
• 6 : 1 ratio X-Y manipulator
• Electronic ball size control
• Semi-automatic and manual bonding